Thermaltake

Thermaltake TG-30 heat sink compound Thermal paste 4.5 W/m·K

R 229.77

CL-O023-GROSGM-A

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R 229.77
R 229.77
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    TG-30 Thermal Compound

    TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

    High Thermal Conductivity
    The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.

    Easy to Apply
    Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.

    All-In-One Application Kit
    This thermal compound application kit includes a set of easily-applied tools for immediate use.

    Sustainability and Safety
    The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
    Non-electrical conductive compound ensures better safety measures for you and your system.

    Features
    Type Thermal paste
    Thermal conductivity 4.5 W/m·K
    Product colour Black
    Packaging data
    Quantity per pack 1 pc(s)

    Delivery

    Orders are dispatched from our Linbro Park warehouse, Sandton. Nationwide courier delivery across South Africa.

    Delivery times vary by location. See our Shipping Policy for full details.

    Returns

    Unopened items may be returned within 7 days of delivery. Faulty, damaged or incorrect items are returned at our cost. Full terms are in our Refund Policy.

    Warranty

    Products are covered by the manufacturer's standard warranty, where applicable. If you need help with a warranty claim, contact us and we'll guide you through the process.